SLICING/DICING

Multi-wire saws are essential for the precision slicing required in semiconductor manufacturing. At GTI Technologies, we are known for the efficiency and ability to produce high volumes of wafers with uniform thickness, which is integral in producing high-quality electronic components. Innovations in multi-wire saw technology have allowed for significant advancements in the semiconductor industry, ensuring that the wafers produced are cut to exact specifications with minimal material loss. Manufacturers can optimize their operations, reduce waste, and maintain a competitive edge in the fast-paced electronic market by selecting the best multi-wire saws.

DICING

We specialize in the design and manufacture of high precision dicing machines. Our machines are engineered for optimal quality, efficiency, and reliability, making sure you achieve the best results for your projects. Whether you are in the semiconductor, electronics, or photonics industry, our comprehensive range of dicing machines is tailored to meet your requirements. In the rapidly evolving world of semiconductors, photonics, and the electrical sectors, selecting the correct dicing machine for your needs can make all the difference when it comes to product quality and efficiency. Selecting a machine tailored to your specific needs not only ensures reliability of your components but can also increase production capabilities.