TAKATORI SEMICONDUCTOR Process EQUIPMENT
ABOUT
TAKATORI SEMICONDUCTOR EQUIPMENT
For 25 years, Takatori has been delivering process equipment to the semiconductor industry. Their core applications are BG tape lamination, dry film lamination, tape removal after grinding, and wafer mounting. In this area, Takatori can provide solutions for the most demanding thin-wafer applications, including Taiko™. Takatori has gained decades of expertise and is highly experienced in the lamination of advanced films, including dry film, DAF, and NCF. They also offer specialized equipment for wafer bonding, remounting, metal lift-off, and more.
Takatori can offer different types of lamination technology, vacuum and atmospheric, front side or backside, allowing for embedding, conformal, or tenting processes, and we have strong experience with a wide variety of films.
DISCOVER PRECISION WITH OUR EQUIPMENT
With a firm commitment to innovation and quality, we invite industry professionals and businesses to explore our high-end semiconductor manufacturing equipment range. Whether upgrading your facilities or establishing a new production line, our semiconductor equipment ensures that manufacturing processes are carried out with unparalleled precision. Our team of experts will assist in meeting the high levels of optimization the semiconductor industry demands. With seamless integration of our advanced tools into your operations, you can elevate your productivity and product quality to new heights. Contact us today for unmatched services.