Backgrind Tape 

Backgrind tape is an essential component within the semiconductor manufacturing process, designed to safeguard wafers during the thinning stage known as backgrinding. At GTI Technologies, our specialized adhesive tape provides the necessary support to delicate wafers, preventing breakage and surface damage that could otherwise occur from the mechanical stresses of grinding. The use of backgrind tape is critical in maintaining the integrity of the wafer as it undergoes various levels of stress, ensuring that high-quality, defect-free wafers are produced for subsequent processing steps.

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Over 45 years of experience
All over North America and Europe
Delivering and supporting machines

Benefits of Background Tape


The benefits of utilizing high-caliber backgrind tape in semiconductor fabrication are numerous. Backgrind tape not only protects the wafer surface from potential contaminants and damage but also aids in maintaining wafer uniformity and flatness, which is essential for subsequent processing steps like permanent bonding or metal liftoff. By employing backgrind tape from our trusted supplier of manufacturing equipment, manufacturers can ensure a reliable process that yields consistently high-quality results. Moreover, backgrind tape is designed to withstand various chemicals and temperatures that wafers are exposed to during the semiconductor equipment processes, highlighting its importance in the production of semiconductors. We provide top-of-the-line backgrind tape solutions that are tailored to meet the stringent requirements of the semiconductor industry. Our backgrind tape is engineered for optimum adhesion, cleanliness, and ease of removal, facilitating a smooth transition between manufacturing stages.

A person in a cleanroom suit and gloves is handling a silicon wafer with a shiny, reflective surface. The wafer is held over a transparent container, with another wafer inside. Computer monitors are visible in the background.

Our Process

01.

Work together with our customers and suppliers to clearly understand the application and our customer’s needs and potential solutions. 

02.

Test our preferred solution, evaluate with the customer. 

03.

Present and then deliver solutions on-time. 

04.

Support our customers with training, spare parts, and ongoing engineering resources. 

MORE ABOUT US

Order Your Backgrind Tape


If you're looking to enhance the protection of your semiconductor wafers during the backgrinding process, order your backgrind tape from us. For more information about our products or to place an order, contact us today. Our dedicated team is ready to assist you with selecting the best backgrind tape to match your specific needs, ensuring that your semiconductor production is seamless, efficient, and of the highest quality. Call us today for any metal liftoff service you might require.

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By kchandler July 7, 2025
Visit GTI at SEMICON EUROPA, NOV 2025 
By kchandler July 7, 2025
Visit GTI at SEMICON WEST, OCT 2025
November 8, 2024
Visit GTI at ECTC, May 2025

Contact us







Hours

Monday - Friday: 8AM-5PM


Service Area

6 Armstrong Road,

Shelton, CT 06484, USA


Phone


European Contact

JTA Equipment Technology

+44 7906 388 508

jta-ltd.com