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Visit GTI at ECTC, May 2026

Tue, 27 Jan 2026 19:16:06 GMT

Visit GTI at ECTC, May 2026

Event page: Welcome - ECTC
Date: May 26-29, 2026
Location: Orlando, FL

ECTC 2026 is a premier global event for electronic components and packaging—bringing together innovators, researchers, and industry leaders to explore technologies shaping the future of advanced electronics. Visit us at Booth 238, where we will be co-exhibiting with JTA Ltd. this May in Orlando !

Visit GTI at Photonics West, Jan 2026

Fri, 05 Dec 2025 15:13:38 GMT

Visit GTI at Photonics West, JAN 2026

Event page: SPIE Photonics West
Date: Jan 17-22, 2026
Location: San Francisco, CA

SPIE Photonics West is the premier global event for optics and photonics—bringing together innovators, researchers, and industry leaders to explore breakthroughs shaping the future of light-based technologies. Visit us at Booth 5409, where we will be co-exhibiting with I-Photonics UAB this January in San Francisco !

Visit GTI at SEMICON EUROPA, Nov 2025

Mon, 13 Oct 2025 18:24:37 GMT

Visit GTI at SEMICON EUROPA, NOV 2025

Event page: www.semiconeuropa.org
Date: Nov 18 - 21, 2025
Location: Munich, Germany

SEMICON Europa 2025, co-located with productronica in Munich, is the leading event for electronics manufacturing in Europe—uniting the entire supply chain for innovation, insights, and networking. Visit us at booth C1261 on November 2025 in Munich!

Visit GTI at SPIE Optifab, Oct 2025

Mon, 13 Oct 2025 18:21:04 GMT

Visit GTI at SPIE. OPTIFAB, Oct 2025

Event page: SPIE Optifab 2025
Date: Oct 20-23, 2025
Location: Rochester, NY USA

SPIE Optifab in Rochester, NY is the premier North American event for optical fabrication, bringing together industry leaders, engineers, and researchers to showcase the latest advancements in optics manufacturing, metrology, and materials. Visit Booth 1118 where we will be Co-Exhibiting with I-Photonics!

Visit GTI at SEMICON WEST, Oct 2025

kchandler@gti-usa.com — Mon, 07 Jul 2025 15:08:29 GMT

Visit GTI at SEMICON WEST, OCT 2025

Event page: www.semiconwest.org
Date: October 7-9, 2025
Location: Phoenix, AZ

SEMICON West 2025 makes its debut in Phoenix, October 7–9—positioning the city as a key hub for innovation and industry growth. This milestone event gathers global leaders across the microelectronics supply chain to explore transformative technologies, develop the future workforce, and drive strategic collaboration. We look forward to seeing you in Phoenix at GTI’s booth in October 2025!

Visit GTI at ECTC, May 2025

Fri, 08 Nov 2024 21:58:09 GMT

Visit GTI at ECTC, May 2025

Event page: https://www.ectc.net/
Date: May 27 – 30, 2025
Location: Dallas, TX

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in components and microelectronic systems science, technology in an environment of cooperation and technical exchange. Please stop by at GTI’s booth #109 in Dallas, Texas!

Wire Sawing vs Other Cutting Methods

Tue, 18 Dec 2018 17:48:39 GMT

Wire sawing, whether using abrasive slurry or diamond wire, offers distinct advantages over other cutting methods in many applications. The high precision, reduced kerf loss, and reduced damage of wire sawing can have a substantial effect not only on the cutting process, but also on downstream operations.

REDUCED KERF LOSS:

The first advantage of wire sawing is reduced kerf loss (the material lost during cutting). Compared with ID saws (0.300 to 0.500mm kerf) and diamond blade saws (0.200 to 3.00mm), a multi wire saw can produce kerfs of less than 0.200mm with slurry, and 0.15 to 0.26mm with diamond wire. This material savings add up; after spending substantial time and money growing a perfect crystal or other material, reducing kerf loss helps save precious material and increase yields.

REDUCED DAMAGE:

Wire sawing is a relatively gentle process, particularly when cutting with slurry. The gentle, low-force cutting action and fine abrasive leads to reduced depth of damage on the cut surface. This reduction in sub-surface damage means less stress in the material and less material that needs to be ground, lapped, or polished after slicing. Once again this saves material, and reducing the amount of removal necessary after slicing means a customer can cut thinner pieces, further improving yields and lowering cost.

The reduced damage also extends to the entry and exit points of the cut – the gentle cutting action means less chipping or other physical damage, leaving clean corners and improving quality.

Even cutting with diamond wire, a more aggressive process than slurry, is quite gentle relative to other cutting methods, so many of the same benefits apply.

BETTER GEOMETRY :

A goal of any cutting method is to create flat, consistent pieces, and here a wire saw excels. TTV, bow, and warp are all minimized. This again reduces the need for post-processing, improving yields.

HIGHER THROUGHPUT:

On the surface, wire sawing is slow. The trade off of such a gentle cutting method is that the machine moves through the workpiece slowly, so cycle times are long. Despite this, wire sawing is actually very efficient due to the use of multiple wires. A production machine can have hundreds of wires contacting the workpiece simultaneously. As a result, at the end of a single cutting cycle the entire length of material will be completed.

On particularly hard materials, using diamond wire can significantly improve throughput, though it can also raise the cost per slice. We examine each application to find the most efficient process.

Wire sawing is an excellent solution to many of the challenges facing companies looking to produce wafers and other thin pieces from delicate, valuable, and very hard materials. It is the best solution for slicing silicon carbide, sapphire, GaN, glass, ceramics, and more. Contact GTI today to learn how wire sawing can work for your application.

Vacuum Lamination

Thu, 30 Aug 2018 17:07:19 GMT

Vacuum lamination stands out as a superior process in the fabrication of semiconductor components, offering unmatched precision and adherence for advanced films and substrates. At GTI Technologies, our innovative vacuum lamination technique ensures that materials are bonded together without the presence of air bubbles or contaminants, which is critical for the integrity and performance of electronic devices. Our vacuum lamination process has become a key player in manufacturing complex, layered structures required in today's high-tech industry, enabling the production of smaller, more powerful, and more reliable semiconductor devices.

What Sets Vacuum Lamination Apart in the Fabrication Process?

Vacuum lamination is indispensable when working with sensitive components that cannot tolerate the slightest imperfection. As the best supplier of manufacturing equipment in the US, our vacuum lamination technology is designed to meet the industry's exacting standards.

Vacuum Lamination for Advanced Films

The precision of vacuum lamination is pivotal for modern semiconductor fabrication. Its ability to produce bubble-free, uniform layers differentiates it from other bonding methods or manufacturers seeking state-of-the-art semiconductor equipment . Our systems provide a solution that enhances the quality of tape lamination, which is crucial for protecting and insulating semiconductor wafers.

Tape lamination has moved far beyond the standard backgrinding application as companies have created new films for MEMsvs, bumps, pillars, and other advanced packaging applications. The Takatori TEAM approach provides the most innovative and capable solution for laminating these films, providing the highest quality lamination for the most demanding applications. Some of the lamination machines we provide include:

Vacuum Lamination - Standard tape lamination generally rolls tape onto a wafer, but it is often better to laminate using a vacuum to achieve the highest quality lamination. The Takatori TEAM series of machine laminate wafers are in a vacuum chamber without rollers and with very low force. The result is even lamination that fills in even deep features but eliminates microbubbles. Lamination can be done at such low force that backside lamination is possible, even when using a non-contact chuck.
Pre-Cutting Tape - Tape laminators usually laminate tape onto a wafer and cut the tape along the edge of the wafer, but the Takatori TEAM-series uniquely separates tape cutting from lamination. Tape is pre-cut on a separate stage and then is transferred to a vacuum chamber, where it is laminated onto a wafer. This not only provides for zero-tension lamination but also allows for “inner cutting,” a technique where the tape circle is cut to a slightly smaller diameter than the wafer. This avoids overhanging edges and applies the film only where needed.
Multi-Layer Lamination—The tapTEAM series' tape pre-cutting capabilities open the door to multi-layer lamination, allowing customers to layer multiple layers of tape onto a wafer.

In conclusion, the Takatori TEATEAM series lamination machines provide a unique capability to customers looking for an advanced lamination solution. Our sophisticated wafer lamination capabilities ensure optimal outcomes for a range of applications within the electronics sector.

Learn More About Our Vacuum Lamination Capabilities

As a leader in vacuum lamination technology, we are dedicated to providing our clients with the very best solutions for their semiconductor fabrication needs. If you are looking to refine your production process and achieve superior product quality, we invite you to learn more about our advanced vacuum lamination capabilities. So please contact us if you desire personalized assistance or would like to discuss how our vacuum lamination systems can be integrated into your operations; our expert team is ready to support you in revolutionizing your fabrication process and achieving the high level of optimization that today's semiconductor industry demands. To learn how we can help further, navigate our “ about us ” page.

Keeping Your Wiresaw Running Well

Wed, 22 Aug 2018 16:52:13 GMT

Takatori Multiwire Saws are designed for years of high-volume production with many customers are running their machines around the clock.

The machines require regular attention to maintain this high level of productivity and here are a few tips on what to do.

GTI Engineering and Service Visits
Every new technology purchase has a learning curve; think about a new computer, a new phone, anything new. When you are new to your wiresaw, the best way to take advantage of Takatori’s great technologies is to have regular service visits scheduled. Training is included with every new Takatori wiresaw, but spending additional time with an experienced GTI engineer after you’ve had some time to work with the machine is always valuable. These visits can include preventative maintenance, training, process advice and simply answering the myriad of questions that always arise as the machine is put into production.
Keep Your Machine Clean
Cleanliness is always important in the manufacturing area but don’t forget the inside. Saws don’t really require a lot of skilled trade maintenance support on a regular basis; however, it is important that the skills of a trained operator include cleaning the interior of the saw, particularly behind the wall where most of the saw’s mechanical systems are. Not only does this avoid problems, it also makes working inside the machine much easier (and more pleasant) if a problem occurs that requires access to the innards of the tool.
Use the Recommended Pulley Bearings
Yes, you may find bearings that last longer, you may also find cheaper bearings, but they will not have the same internal fit. The wire management system on these machines is finely tuned to minimize wire breaks. Putting non-standard bearings into the pulleys may seem like a minor change, but it can lead to more frequent wire breaks. Putting thousands of dollars of material at risk to save a few dollars on pulleys is not a good idea.
Tune Your Slurry
If you’re looking to increase productivity, don’t just look at speeding up the wire to increase cutting speed, look at your slurry. All mechanical parts have an expected life span and increasing wire speed can negatively effect the lifespan of spindles, bearing and pulleys. To speed up, consider changing the abrasive rather than the speed. With slurry saws, data shows that increasing spindle speeds to slice quicker is not as effective as grain loading (increasing the amount of cutting ability of the slurry). Ask a GTI engineer; he can help you optimize your process.
Check Your Wire Reels
Before putting them on the machine, check your wire reels for wear, damage and debris. Wire reels are made to a close tolerance. If the distance between the edges becomes larger (wider), you can adjust the traverser to the larger width and reduce the tension of the wire coming onto the reel. Takatori has advanced the software so the software you slice with doesn’t have to be the tension you wind on your collect reel.

Metal Liftoff – A Effective Alternative to Chemical Etching

Tue, 12 Jun 2018 16:54:28 GMT

Many semiconductor devices particularly those made with gallium arsenide (GaAs) or indium phosphide (InP), require the removal of metal layers by etching. Gold, for example, difficult and expensive to remove by etching due to its inertness. Lift off provides an alternative to etching. A pattern is first created in a sacrificial layer of photoresist before the gold is the deposited. The gold adheres strongly to the underlying device layers of GaAs (or deposited insulating layers,) and also to the photoresist which does not adhere as strongly to the device layers.

Standard lift-off processes use solvents to remove the resist, and often take the gold with it. The main problems with this process are:

redeposition of the gold from the solution onto the wafer,
disposal of the solvent is expensive, and
reclaiming the gold from the solvent is not easy and it is too costly to throw away.

Takatori’s AMR-2200G system provides an effective alternative that does not use solvents! The system applies an adhesive tape to the wafer surface and then lifts it off in a controlled manner designed to match the specific device requirements. The gold on the photoresist is removed with the resist, while the gold adhered to the underlying device layers remains on the wafer surface undisturbed.

Benefits of this lift off with tape are:

eliminates potential for gold being redeposited on the wafer surface,
lowers overall cost since no solvent disposal is need, and
makes it easy to reclaim the gold from the roll of tape.

This process is used successfully by many GaAs device fabricators. It can be used with many different metals; including gold, indium, and aluminum.

Contact GTI today to learn more about Takatori’s tape-based liftoff solution and how it can improve your bottom line.

Custom Semiconductor Solutions

Wed, 30 May 2018 17:05:23 GMT

In the constantly evolving world of semiconductor manufacturing, customers often seek special machines for new applications.

For decades GTI and Takatori have provided customers with special machines customized to meet their specific needs. Takatori is able to add many optional features to their machines, including Bernoulli-type end effectors, OCR/BCR, special cassettes for thin wafers and more, but our ability to customize goes far beyond adding options.

Recently, a customer came to GTI seeking a solution for laminating the backside of a wafer. Takatori made extensive modifications to its TEAM-100ARF vacuum laminator to meet their needs, including low-contact end-effectors, wafer flipping, and an edge-contact lamination chuck. The TEAM-100ARF’s unique low-force lamination process allow for high-quality lamination with very low force; this unique lamination method makes it possible to laminate a wafer held only on the very edges and unsupported in the middle, protecting the patterned active side of the wafer.

Oftentimes, customer modifications yield solutions that become standard process for a number of applications industry-wide. Such is the case with dry film lamination, which began in the 1990s as a customized solution for a customer requiring special tape handling, more robust lamination pressure control, and a special heated chuck. What started as a custom machine became a standard solution as more customers approached the same challenge.

We have built special laminators, detapers, mounters and more. How can we help with your challenge? Contact GTI to learn about Takatori’s customized machines.

Wiresaws: 5 Best Practices for Fast Changeovers & Maximum Run Times

Mon, 09 Apr 2018 17:09:44 GMT

Get Maximum Productivity from your Takatori Wire Saw with these 5 Best Practices

You’ll get the most out of your Takatori wire saw when you follow this guide to best maintaining and repairing these five crucial parts. The result will be faster changeovers and maximum machine run time. A key concept to remember is that the cycle time on a multi-wire saw is often quite long and operator intervention is rarely required, so you should take advantage of this time to prepare for the next run.

1. Workrollers

Have your new work rollers out and ready when it’s time to turn the machine around. Use a work roller cart to safely remove the old rollers and to place the new ones onto the machine. Make sure to follow the detailed instructions for disassembling and reassembling the front yoke bearing assemblies – seating the work rollers and bearings is critical for proper operation of the machine.

2. Pulleys

Pulleys need to be changed occasionally as they wear during the slicing process. Overly worn pulleys can lead to wire breaks, so make sure to inspect them for wear frequently when a process is new to determine the best replacement schedule. Pulleys closer to work box may wear faster, so make sure to check all pulleys.

In order to speed up replacement, you can purchase a second set of pulley assemblies and bearings, meaning that you can set up a new pulley on each assembly while the machine is running. Switching out the assemblies is then quite fast, speeding up your turn around.

3. Re-winding

Takatori wire saws are uniquely self-winding, with a program managing the placement of wire onto the work rollers. Up to 100 different winding programs can be stored on the machine. Use block winding programs to leave gaps in the wire web if desired, or use skip winding to slice different thicknesses using the same set of work rollers. Save your programs to more quickly set up the machine.

4. Loading

If your work is heavy make sure to a cart to safely remove the cut pieces and place the new workpiece into the machine. Make sure to have multiple mounting plates so that you can mount new workpieces with enough time for the epoxy to cure while the machine is running.

5. Slurry Preparation

Slurry needs time to ensure proper mixing. Once again, this can be done while the machine is running in order to save time. A dedicated slurry mixing tank can be as simple as an appropriately-sized container and an impeller, allowing you to pre-mix abrasive and the vehicle (generally oil or glycol).

Your GTI engineer can also work with you on progressive slurry replacement, which allows for a more stable process by replacing only a small amount of the slurry from time to time.

If you have any questions please contact GTI at +1 203 929 2200.

40 Years of Manufacturing Excellence

Tue, 03 Apr 2018 17:11:40 GMT

For 40 years, GTI has been evolving to provide advanced manufacturing solutions to its customers. When the company opened its doors on Oct. 1, 1978, Grinding Technology Inc. focused not only on importing leading-edge metalworking equipment from Europe to the United States; but also on supporting customers once their machines were up and running.

About 10 years later, the company began to branch out into the semiconductor industry, working with GMN to sell wafer grinders. This included the MPS-T500, the first fully automatic, cassette to cassette wafer backgrinder brought to market. In order to provide a complete solution to semiconductor companies, GTI entered a partnership with Takatori to provide tape, detape, and mounting equipment in 1989.

As the business evolved and the semiconductor industry continued to grow, Grinding Technology Inc. re-branded itself as GTI Technologies, Inc., in 1997 reflecting its diversification. The partnership with Takatori also grew deeper as GTI began to offer their new multi wire saws.

By 2000 GTI’s business was almost solely focused on the semiconductor and advanced materials businesses, and this remains our focus today.

GTI led the way to develop wire slicing of mono-crystalline sapphire and silicon carbide. Working together with customers, GTI helped to pave the way for the blue and white LED revolution, and played a key role in the rapid growth of today’s advanced power devices. The company continues to provide advanced solutions for leading semiconductor companies in North America and Europe.

We thank our customers and our suppliers for their support over the last 40 years, and we look forward to working together to make a better future.

Takatori Temporary Bonding Solutions

Mon, 19 Mar 2018 17:12:47 GMT

Developments in advanced packaging and 3D integration have driven the demand for better ways to work with ultra-thin wafers safely. The need to run thin wafers through processes beyond the standard post-grinding steps (like polishing, detaping and dicing) has driven demand for cost-effective ways to bond ultra-thin wafers to a carrier made of sapphire, glass, silicon, or other materials.

Many temporary bonding methods have featured spin-on adhesive, which requires complex, expensive machines.

In 2003, Takatori began offering its WSM-series machines, providing a unique temporary bonding solution featuring double-sided tape. Unfortunately, the double-sided tapes available at that time were not capable of surviving high-temperature processes, and this limited the appeal of Takatori’s new machine.

Fortunately double-sided tapes have continued to evolve, and today both Nitto’s Revalpha and Sekisui’s Selfa tapes can survive higher temperatures while maintaining good adhesion and allowing for easy debonding.

Today, Takatori’s WSM-100 offers a cost-effective solution for temporary bonding. The machine uses a combination of atmospheric lamination and vacuum bonding, and works with many types of carrier wafers and different tapes. Today’s tapes are either heat-release or UV-release, and both types are supported by Takatori’s debonding/mounting tool, the WSM-200.

Call GTI Technologies today at +1 (203) 929-2200 or contact us via the web at gti-usa.com to find out how the WSM-series of machines can address your temporary bonding needs.

New Concepts for Cutting Core Materials

Mon, 05 Mar 2018 18:13:54 GMT

Diamond wire, originally developed for cutting hard, crystalline materials, offers a new solution for cutting core materials. The technology provides numerous advantages over traditional technologies including multi-axis machining centers and bandsaws. It is an effective tool for cutting a wide variety of materials quickly and efficiently.

Diamond wire technology:

1. Reduces Damage – Diamond wire cutting, while effective for even the hardest materials, is a relatively gentle process when compared to the more aggressive, traditional machining methods. Diamond wire uses a very fine abrasive on a thin wire, and even fast cuts can leave behind pristine edges and surfaces. Delicate feathered edges are possible, with honeycomb cells left completely intact even on the sharpest angles.

2. Minimizes Kerf Loss – Diamond wire is thin, (the current standard for cutting composites is only ~0.350mm in diameter,) – minimizing material loss. Customers get more parts out of a given quantity of core material with diamond wire cutting, lowering costs.

3. Offers speed – Despite the gentle cut and thin wire, diamond wire technology cuts materials at high speed, even in thick and dense cores. The use of a multi-axis industrial robot with the Takatori TWR-300 Robot Wire Saw opens the door to cutting complex shapes on a relatively inexpensive platform, saving time and money.

4. Generates Fewer Particles – Diamond wire cutting requires no coolant and only generates a small amount of fine dust.

While new to the composites industry, diamond wire technology has been used extensively in industrial applications for almost 20 years, making it a mature, reliable technology. Contact GTI to learn more about how diamond wire can help you with your application.

What Is Diamond Wire?

Mon, 19 Feb 2018 18:15:12 GMT

Diamond wire, originally adopted for mass production by the sapphire industry and then by the silicon industry, significantly increases the productivity of wire sawing and provides downstream benefits as well. It also offers an interesting option for cutting composite materials: demonstrating advantages when cutting both core materials and carbon fiber.

Diamond wire is made in a number of ways, but the most common way is by attaching fine diamond particles to steel wire through an electroplating process. Wire manufacturers provide the nominal diameter of the wire and the diamond abrasive, as well as the core diameter (the diameter of the wire itself) and the size of the abrasive particles. While the most commonly used wires don’t offer high diamond density, wire makers can fine tune the abrasive density and some offer particularly high-density diamond wire for special applications. Resin-bonded diamond wire is also available, though it is less common.

Advantages of Diamond Wire: Fast, Clean, Gentle

The first advantage of diamond wire is speed. Conventional slurry-based wire sawing can be slow when cutting very hard materials. Diamond wire offers substantial improvements in speed, increasing the productivity of each machine.

Next, diamond wire is clean. The coolant required for cutting is primarily water, with a small amount of surfactant added. This makes for easy set up, and also makes it easy to reclaim material lost during the cutting process.

Finally, while diamond wire is more aggressive than slurry for cutting crystalline materials, it is a relatively gentle process for cutting composites. It allows for very fine edges on core materials, less deformation of metallic core, and when cutting carbon fiber it offers lower damage, less delamination, and higher surface quality.

Contact GTI today to learn more about how diamond wire may help you with your applications.

Installation guide for a Takatori Wire Saw from GTI

Fri, 15 Dec 2017 18:17:45 GMT

You’ve made the investment in your new Takatori wire saw, and now we’re here to help you make that machine a success. Good support is key, and with GTI it starts even before the new wire saw arrives. Here’s a guide to the logistics of receiving and installing your new wire saw. These instructions must be followed to ensure a smooth installation and avoid any warranty issues. Please follow them closely.

PREPARING FOR THE ARRIVAL OF YOUR NEW WIRE SAW

Prior to the arrival of your new machine there are some steps to be taken to ensure a smooth startup.

1. Select an area where the machine will be placed. Ensure that the floor is ready for the weight of the machine, and that there is adequate clearance around the new wire saw to allow for the chiller units, slurry pot, and opening of maintenance panels. GTI will provide a floor plan for your machine.

2. Prepare all utilities for the machine. Utilities required may include (but not be limited to):

electrical lines
pneumatic lines
water lines
exhaust venting hoses

Make sure that the capacity of each utility is appropriate for the machine. Lines should be ready to be hooked up when the machine arrives. The GTI engineer will perform the hookup during installation.

3. Order all machine consumables so your are ready for the startup. This includes:

Slicing Wire
Slurry abrasive
Slurry vehicle
Mounting blocks
Mounting glue

GTI can help you with all of your consumable needs, contact us at +1 203 929 2200.

4. Prepare product material. Make sure to have ingots ready to be sliced when the machine is installed.

SHIPPING & TRANSPORTING YOUR TAKATORI WIRE SAW

GTI will arrange for the wire saw to be transported to the port of entry. You are typically responsible for shipment once the saw clears customs, but we can also arrange shipment directly to your site, should you choose this option at the time of purchasing the wire saw. This is arranged by a GTI Technologies Customer Service Representative as soon as we receive word as to when the saw will be ready for shipment.

If your company is arranging shipment from the port of entry to your facility, please make sure to arrange for an air-ride truck. Prior to the machine’s arrival, make sure that you have the ability to off-load the machine and move it into place. When the crate arrives, make sure to check it for any damage during shipment; make a note and take photographs of any damage and inform GTI immediately.

If you are accepting the machine after a run-off at the factory, shipping will be scheduled for as soon as practical after the run-off. If you have a preferred carrier you would like to use, please let us know at the time of order placement in the Purchase Order. Otherwise we will arrange all shipping and transportation details through our normal channels.

Takatori Wire Saw Installation Checklist

1. Dismantle crate.

2. Remove the Operator’s Manual and read the installation instructions carefully. [Please note, the manual can be provided prior to shipment in pdf format, should you choose. Just ask your Customer Service Representative.]

3. Check Packing List against the machine and accessories received, as well as against your original Purchase Order. Inspect all items visually for possible shipping damage. If you find any discrepancies in the order, or you find any shipping damage, please contact the GTI Customer Service Representative immediately by calling +1 203 929 2200.

4. Move the new machine to its desired location. [Leveling feet already there?]

5. Bring all utilities to the machine, but do not connect them yet. Utilities required may include (but not limited to):

electrical lines
pneumatic lines
water lines
exhaust venting hoses

On the first day of installation your GTI technician will double check all utilities for compatibility before connections are made. If you have any questions, please contact us immediately at +1 203 929 2200.

6. Clean the new wire saw machine of all rust preventative materials and any residue that may have accumulated during shipment.

7. Have all machine consumables in place and ready for use. This includes:

Slicing Wire
Slurry abrasive
Slurry vehicle
Mounting blocks
Mounting glues
Sufficient workpieces for testing

If you have any questions as to what is required, contact your GTI Customer Service Representative.

Our goal is a smooth installation that puts you into production as soon as possible. These instructions avoid delays when our technicians are onsite (which could result in additional charges) and help to ensure your warranty coverage.

CUSTOMER SERVICE & TECHNICAL SUPPORT

Should you have any questions or issues once your new Takatori Wire Saw is installed, GTI is here to help. Please contact our Technical Support Team at +1 203 929 2200, Monday through Friday, 8 am to 5 pm EST.

Cutting Composites with Diamond Wire

Fri, 08 Dec 2017 18:19:45 GMT

Diamond wire has been used for many years by companies looking to cut very hard materials, particularly sapphire, into thin wafers. Producers needed a fast cutting method that minimized material loss and damage, and diamond wire delivered.

Takatori has taken decades of wire saw experience in hard materials and created a small, flexible wire saw designed to be mounted on an industrial robot to cut composite materials. This is a new cutting method for composites, and it offers certain advantages.

REDUCED DAMAGE

One of the greatest advantages of diamond wire is the reduction in damage. When cutting honeycomb materials, aggressive cutting methods can damage the workpiece. Delicate feathered edges can be difficult, particularly when cutting aluminum core. diamond wire can deliver uniquely low-impact cutting, delivering precise results even when cutting the most delicate parts. The reduced damage during cutting also reduces the need for hand-finishing, saving material and time.

When cutting carbon fiber, diamond wire cutting delivers a high quality cut while almost eliminating delamination, leaving behind a clean, straight cut without hanging fibers.

Diamond wire cutting can also be an effective solution for cutting sandwich panels, as it quickly cuts through both carbon fiber and various core materials.

CLEAN CUTTING

Cutting with diamond wire saves time down stream not just by delivering high quality cuts, but also by being clean. Particle generation is minimal, and the minimum damage to the workpiece also means less particulate. Cutting is also usually done dry, without coolant, eliminating another potential source of problems.

SPEED

Cutting composite materials with diamond wire has certain speed advantages. The machine can cut through various core materials quickly and efficiently, with the multi-axis robot providing a capable platform for making complex shapes. Some geometry can be cut much more efficiently than with competing technology.

When cutting thick carbon fiber some real advantages become apparent. In addition to the excellent cut quality, diamond wire is capable of cutting quickly through even very thick CF, and cutting prepreg is also possible.

COST

Diamond wire is competitive with other cutting technologies, and the constant pressure from the sapphire and solar markets for higher quality at lower prices will continue the downward path of diamond wire pricing.

We look forward to working together with you to see how diamond wire cutting can help your composites application.

Click here for more info: https://gti-usa.com/product/robot-wire-saw/

Takatori Slicing Solutions for R&D and Pilot Production

Mon, 04 Dec 2017 18:21:49 GMT

The WSD-K2 and WSD-K3 deliver Takatori slicing quality and reliability for customers looking for smaller-scale slicing capability. Whether used for pilot production, material R&D, or process development, the K2 and K3 offer a powerful, flexible solution to customers not yet ready for a production-scale machine. It also finds use at production facilities for development purposes, cutting seed crystals, and other applications that would otherwise occupy a production machine.

WHY CHOOSE THIS MACHINE OVER THE COMPETITION?

The WSD-K2 and K3 are first and foremost Takatori wire saws. Takatori has been building multi-wire saws for 30 years, and is the industry standard for numerous applications. While small, the K2/K3 still offers Takatori quality, both in build and output. A robust control system allows for detailed, multi-step programming of slicing parameters, and the available Y/Theta table allows for multi-cut programming for cutting longer pieces or for dicing applications. The K2/K3 can be operated in single wire or multi-sire modes, and can quickly be switched between the two. Use wire from any manufacturer, including very thin wire. The WSD-K2 and K3 are quiet, capable, and dependable.

WHY CHOOSE A SMALLER WIRE SAW OVER A LARGER WIRE SAW?

Sometimes a small saw is all you need. With numerous materials the crystals are small, whether due to manufacturing constraints or demand, and a large wire saw is not feasible. For other companies that already have multi-wire saws, they may not want to sacrifice production time for small-scale development or cutting seed crystal, making a small wire saw a good investment.

WHAT CAN IT DO?

The K2/K3 uses diamond wire to cut various materials, usually (but exclusively) monocrystalline materials for semiconductor, photonics, or optical applications. The WSD-K2 can cut materials up to 156mm in diameter, and the K3 up to 200mm in diameter, using diamond wire. The machine can operate with a single wire or multiple wires, depending on customer needs.

cd14a6b2

Visit GTI at ECTC, May 2026

Visit GTI at ECTC, May 2026

Visit GTI at Photonics West, Jan 2026

Visit GTI at Photonics West, JAN 2026

Visit GTI at SEMICON EUROPA, Nov 2025

Visit GTI at SEMICON EUROPA, NOV 2025

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Visit GTI at SPIE Optifab, Oct 2025

Visit GTI at SEMICON WEST, Oct 2025

Visit GTI at SEMICON WEST, OCT 2025

Visit GTI at ECTC, May 2025

Visit GTI at ECTC, May 2025

Wire Sawing vs Other Cutting Methods

REDUCED KERF LOSS:

REDUCED DAMAGE:

BETTER GEOMETRY :

HIGHER THROUGHPUT:

Vacuum Lamination

What Sets Vacuum Lamination Apart in the Fabrication Process?

Vacuum Lamination for Advanced Films

Learn More About Our Vacuum Lamination Capabilities

Keeping Your Wiresaw Running Well

Takatori Multiwire Saws are designed for years of high-volume production with many customers are running their machines around the clock.

Metal Liftoff – A Effective Alternative to Chemical Etching

Custom Semiconductor Solutions

In the constantly evolving world of semiconductor manufacturing, customers often seek special machines for new applications.

Wiresaws: 5 Best Practices for Fast Changeovers & Maximum Run Times

Get Maximum Productivity from your Takatori Wire Saw with these 5 Best Practices

40 Years of Manufacturing Excellence

Takatori Temporary Bonding Solutions

New Concepts for Cutting Core Materials

What Is Diamond Wire?

Installation guide for a Takatori Wire Saw from GTI

PREPARING FOR THE ARRIVAL OF YOUR NEW WIRE SAW

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SHIPPING & TRANSPORTING YOUR TAKATORI WIRE SAW

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Takatori Wire Saw Installation Checklist

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CUSTOMER SERVICE & TECHNICAL SUPPORT

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Cutting Composites with Diamond Wire

REDUCED DAMAGE

CLEAN CUTTING

SPEED

COST

Takatori Slicing Solutions for R&D and Pilot Production

WHY CHOOSE THIS MACHINE OVER THE COMPETITION?

WHY CHOOSE A SMALLER WIRE SAW OVER A LARGER WIRE SAW?

WHAT CAN IT DO?