GTI Technologies, Inc. - Wiresaw- Takatori

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S-MWS 33 D (2 Spindle)

View the brochure in PDF format

MAX WORK SIZE:
(2 Ingots, each up to 5in Dia x 12in Len) 2 Ingots x 127mm Dia x 300mm Len

Similar to the MWS 612 SD machine, but with two workplate vices mounted on one table

For production slicing of Silicon Solar wafers or other hard or brittle materials

Updated two spindle design allows thickness (pitch) range from 0.100mm (0.004in) to about 5mm (0.196in) with minimum kerf loss per wire

"Down" cutting table feed system reduces wire breakage by catching ingot/wafer fragments before being drawn into wire web

Simultaneously cuts two ingot rows (spacing between ingots is no longer an issue)

High speed wire reciprocation, wire reverse cycle is variable for optimal slicing parameters

Rigid fixed yoke increases stability, improves wire guide support

Patented rocking head design increases "lapping effect"

Triple (3x) wire reel capacity of the MWS 34 SN

Fully enclosed wire reels and pulleys reduces splashed slurry, angled stainless steel splash pans for faster fluid return

UPCOMING TRADESHOW

Join GTI at Semicon West, San Francisco, CA
Exhibition: 10-12 July 2012
Click here for more details.

Features:

Windows based user friendly operator interface
Direct drive wire reciprocation system with servo controlled tensioning arms via load cell feedback loop
Flexible computer controlled process variables with real time data backup from run to run
Auto wire winding for precisely controlled wire web spacing
Slurry Chiller system with Heat Exchanger for improved slurry temperature control
Precisely machined slurry nozzles for improved, uniform laminar slurry flow
Note: optional configuration allows diamond coated wire use
Note: wire reel cart option for use in lifting and installing heavy wire reels, ingots, and wire guides

Applications:

Slicing of Solar Silicon and glass materials

Contact GTI for more information