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Fully automatic Dry-resist lamination system
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Designed for the unique needs of laminating dry-resist
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Vacuum chamber lamination eliminates air bubbles and minimizes roller pressure
on wafer
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Features adjustable "inner-cutting"
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Handles thin wafers (up to 150 microns) and maximum bow of 5mm
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Adjustable for a wide variety of resist films
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| Contact
GTI for more information |