The TEAM-100 performs an "inner-cut" of the BG tape, creating a circle of tape
what is slightly smaller then the wafer diameter. This cutting is also done
prior to lamination -- pre-cut tape is not necessary. The inner-cut technique
helps to reduce problems associated with seepage of grinding fluid onto the
frontside of the wafer. Additionally, this lamination technique minimizes the
tension in the tape during lamination and thus avoids adding additional stress.
The actual lamination is done inside a vacuum chamber, another Takatori
innovation. This dramatically reduces the number of bubbles under the tape.
GTI for more information