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Contactless mounting table which holds wafer at 3mm edge part. (Vacuum for
wafer holding is not necessary.)
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The adoption of a vacuum chamber system allows for reduced stress on the
attachment rollers and the elimination of air bubbles, thereby preventing
damage to the wafers and packages.
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Tension control for all types of tapes is possible, so the optimal coating can
be achieved to match post-processing requirements.
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Automatic tape supply, tape coiling, wastage tape coiling, tape cutting.(UV
tape applicable)
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Applicable for thin wafer.
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