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The footprint is smallest for 12h in the world despite the features of DAF
lamination , mounting and BG tape removal.
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Optional In-lining system with a grinder/polisher realizes the solution to the
process of up to 50-micron thick wafers.
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Taking out wafers from a coin stack and open cassette.
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Realize very high material yield at single layer DAF and stable lamination.
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After cure function inside , laminating wafer by wafer.
Vacuum chamber system is adopted for mounting wafer on dicing tape in order to
avoid bubble generation between the tape and wafers as well as to minimize
extra stress on the wafer surface. Either roll or precut type of dicing tape
with DAF is applicable.
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| Contact
GTI for more information |