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DM-812
DM-812: Full-Automatic Die Attach Sheet Lamination System
View the brochure in PDF format
The DM-812 is the ideal system for laminating die attach sheets.
UPCOMING TRADESHOW
Join GTI at Semicon West, San Francisco, CA
Exhibition: 10-12 July 2012
Click here for more details.
Features:
Capable of handling 300 mm (12") 150цm thickness wafers with precise alignment.
Uniform lamination by using special heater and roller control system
After cure function inside, laminating wafer by wafer
Applications:
For Die attach sheet
Contact GTI for more information
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