| Takatori
MWS 812SD Multi-Wire Saw |
The MWS 812SD is the newest
design in the highly successful line of Takatori multi-wire saws. The larger
work envelope, combined with Takatori’s patented rocking head motion, make it
ideal not only for the hard material applications that Takatori has become so
well known for, but also for silicon and solar silicon applications. There are
several other new features that set this system apart from previous Takatori
offerings:
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Work Envelope: 200 mm Diameter x 300 mm Length
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Available with 1000 m/min wire speed
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Optional automatic wire reversal system for diamond wire
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Special cutting fluid filtration system available for diamond wire usage
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| Deckel
S20E: A New Economical Tool Regrinding Alternative |
Deckel has introduced a new
economical version of their patented "Vertical Principle" tool regrinding
machine, the S20E. Faster, stronger and more efficient. With evenly distributed
forces and minimum axis travel, the S20E produces the highest accuracy at a
very attractive price. Check these important features:
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Patented Vertical Design
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6-station Grinding Wheel Changer
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Powerful 9.5 HP Grinding Spindle
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Highly Dynamic AC Motors w/ Digital Servo Controllers
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Fast Set-up Operator Intuitive Software
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| Supfina
MWG |
The Supfina MWG (Modular Wafer
Grinder) is a versatile system for backgrinding and prime-wafer applications on
5" to 12" diameter substrates. Ultra-stable design yields tightest tolerances
on today's thinnest wafer applications. The modular design enables custom
tailored tools for each customer's specific needs.
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Innovative twin tool spindle design – two grinding wheels in one
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Engineered for thin wafer applications
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Modular design: 1 – 3 grinding spindles / field upgradeable
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Possible to grind multiple sizes at one time
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| Deckel
S22E: A New Economical Alternative For Tool Manufacturing |
Deckel has just introduced a new
economical version of their manufacturing proven S22. Same flexibility and
precision that Deckel has become known for –at a more competitive price. Check
these important features:
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Patented Vertical Design
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4-station Grinding Wheel Changer
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Powerful 13.5 HP Grinding Spindle
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Direct Drive in A Axis with up to 600 rpm
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Multiple Automatic Loading Options
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| Takatori
MWS 45 |
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| Meccanadora
Line |
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| JFP
Microtechnic: Die Bonders and Scribe Units For The Microelectronic Industry
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JFP Microtechnic has more than 15
years of experience supplying Die Bonders and Scribe Units with rigid designs
and outstanding performance. All models have been engineered for maximum
accuracy and the handling of very small parts. A broad application range
includes:
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DB-5 U/S Flip Chip Die Bonder:
Engineered for ultrasonic and heavier bonding of delicate devices on
substrates, with accurate placement. A flip option allows perfect alignment.
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DB 1000 Flip Chip P&P
Die Bonder: Achieves extremely high accuracy placement using an
ultra-high magnification optical device.
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Scribe S200-6 and S100-3:
Unique systems designed for low to medium production scribing and breaking of
delicate die, clean and free from damage, in materials such as GaAs.
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| Roentec
Crysotax: Revolutionary Crystal Orientation System
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Revolutionary is a term often
overused in the promotion truly innovative products, but it is fully justified
in the case of the Roentec Crysotax system. The Crysotax is an extremely
compact energy-dispersive X-Ray diffractometer (EDXRD), designed for the
efficient, process embedded orientation measurements of single crystals. It
offers several key advantages:
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Portable bench top device with full radiation protection
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No crystal holding device required. Large specimens can be measured
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Factory fixed X-Ray tube / detector design eliminating the need for
conventional goniometer set-ups
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Short measurement times, done automatically with full evaluation capabilities
There is nothing else like it on the market today.
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